Invention Grant
- Patent Title: Switching element and manufacturing method thereof
- Patent Title (中): 开关元件及其制造方法
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Application No.: US13712343Application Date: 2012-12-12
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Publication No.: US08748975B2Publication Date: 2014-06-10
- Inventor: Hirokazu Fujiwara , Yukihiko Watanabe , Narumasa Soejima , Toshimasa Yamamoto , Yuichi Takeuchi
- Applicant: Hirokazu Fujiwara , Yukihiko Watanabe , Narumasa Soejima , Toshimasa Yamamoto , Yuichi Takeuchi
- Applicant Address: JP Toyota-Shi JP Kariya-Shi
- Assignee: Toyota Jidosha Kabushiki Kaisha,Denso Corporation
- Current Assignee: Toyota Jidosha Kabushiki Kaisha,Denso Corporation
- Current Assignee Address: JP Toyota-Shi JP Kariya-Shi
- Agency: Kenyon & Kenyon, LLP
- Priority: JP2011-272075 20111213
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/336

Abstract:
A switching element is provided having a semiconductor substrate. A trench gate electrode is formed in the upper surface of the semiconductor substrate. An n-type first semiconductor region, a p-type second semiconductor region, and an n-type third semiconductor region are formed in a region in contact with a gate insulating film in the semiconductor substrate. At a position below the second semiconductor region, there is formed a p-type fourth semiconductor region connected to the second semiconductor region and opposing the gate insulating film via the third semiconductor region and containing boron. A high-concentration-carbon containing region having a carbon concentration higher than that of a semiconductor region exposed on the lower surface of the semiconductor substrate is formed in at least a part of the portion of the third semiconductor region, positioned between the fourth semiconductor region and the gate insulating film, that is in contact with the fourth semiconductor region.
Public/Granted literature
- US20130146969A1 SWITCHING ELEMENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-06-13
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