Invention Grant
- Patent Title: Embedded source/drain MOS transistor
- Patent Title (中): 嵌入式源极/漏极MOS晶体管
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Application No.: US13380828Application Date: 2011-08-12
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Publication No.: US08748983B2Publication Date: 2014-06-10
- Inventor: Huicai Zhong , Chao Zhao , Qingqing Liang
- Applicant: Huicai Zhong , Chao Zhao , Qingqing Liang
- Applicant Address: CN Beijing
- Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee Address: CN Beijing
- Agency: Goodwin Procter LLP
- Priority: CN201110112309 20110429
- International Application: PCT/CN2011/078320 WO 20110812
- International Announcement: WO2012/145976 WO 20121101
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/70

Abstract:
An embedded source/drain MOS transistor and a formation method thereof are provided. The embedded source/drain MOS transistor comprises: a semiconductor substrate; a gate structure on the semiconductor substrate; and a source/drain stack embedded in the semiconductor substrate at both sides of the gate structure with an upper surface of the source/drain stack being exposed, wherein the source/drain stack comprises a dielectric layer and a semiconductor layer above the dielectric layer. The present invention can cut off the path for the leakage current from the source region and the drain region to the semiconductor substrate, thereby reducing the leakage current from the source region and the drain region to the semiconductor substrate.
Public/Granted literature
- US20120273886A1 EMBEDDED SOURCE/DRAIN MOS TRANSISTOR AND METHOD FOR FORMING THE SAME Public/Granted day:2012-11-01
Information query
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