Invention Grant
- Patent Title: Contact-force sensor package and method of fabricating the same
- Patent Title (中): 接触力传感器封装及其制造方法
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Application No.: US12547082Application Date: 2009-08-25
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Publication No.: US08748997B2Publication Date: 2014-06-10
- Inventor: Jong-pal Kim , Byeung-leul Lee
- Applicant: Jong-pal Kim , Byeung-leul Lee
- Applicant Address: KR KR
- Assignee: Samsung Electronics Co., Ltd.,Center for University-Industry Corporation
- Current Assignee: Samsung Electronics Co., Ltd.,Center for University-Industry Corporation
- Current Assignee Address: KR KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2008-0128188 20081216
- Main IPC: H01L29/84
- IPC: H01L29/84

Abstract:
Provided are a contact-force sensor package and a method of fabricating the same. The contact-force sensor package includes an elastic layer comprising a side that contacts a source of a contact-force; and a substrate layer adhered to the opposing side of the elastic layer from the side that contacts the source of the contact-force and comprising a cantilever beam separated from the elastic layer and deformed due to the contact-force, a pillar extending from a free end portion of the cantilever beam to the elastic layer and transferring the contact-force from the elastic layer to the cantilever beam, and a deformation sensing element for generating an electrical signal that is proportional to a degree of deformation of the cantilever beam.
Public/Granted literature
- US20100148286A1 CONTACT-FORCE SENSOR PACKAGE AND METHOD OF FABRICATING THE SAME Public/Granted day:2010-06-17
Information query
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