Invention Grant
US08749008B2 Solid-state imaging device, production method of the same, and imaging apparatus 有权
固态成像装置及其制造方法以及成像装置

  • Patent Title: Solid-state imaging device, production method of the same, and imaging apparatus
  • Patent Title (中): 固态成像装置及其制造方法以及成像装置
  • Application No.: US13928915
    Application Date: 2013-06-27
  • Publication No.: US08749008B2
    Publication Date: 2014-06-10
  • Inventor: Keiji Mabuchi
  • Applicant: Sony Corporation
  • Applicant Address: JP
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP
  • Agency: Sheridan Ross P.C.
  • Priority: JP2007-138081 20070524
  • Main IPC: H01L31/0232
  • IPC: H01L31/0232
Solid-state imaging device, production method of the same, and imaging apparatus
Abstract:
A solid-state imaging device in which a pixel circuit formed on the first surface side of a semiconductor substrate is shared by a plurality of light reception regions and second surface side of the semiconductor substrate is the light incident side of the light reception regions. The second surface side regions of the light reception regions are arranged at approximately even intervals and the first surface side regions of the light reception regions e are arranged at uneven intervals. Respective second surface side regions and first surface side regions are joined in the semiconductor substrate so that the light reception regions extend from the second surface side to the first surface side of the semiconductor substrate.
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