Invention Grant
US08749026B2 Nonplanar device with thinned lower body portion and method of fabrication
有权
具有减薄的下体部分的非平面装置和制造方法
- Patent Title: Nonplanar device with thinned lower body portion and method of fabrication
- Patent Title (中): 具有减薄的下体部分的非平面装置和制造方法
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Application No.: US13908858Application Date: 2013-06-03
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Publication No.: US08749026B2Publication Date: 2014-06-10
- Inventor: Uday Shah , Brian S. Doyle , Justin K. Brask , Robert S. Chau , Thomas A. Letson
- Applicant: Uday Shah , Brian S. Doyle , Justin K. Brask , Robert S. Chau , Thomas A. Letson
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
A nonplanar semiconductor device having a semiconductor body formed on an insulating layer of a substrate. The semiconductor body has a top surface opposite a bottom surface formed on the insulating layer and a pair of laterally opposite sidewalls wherein the distance between the laterally opposite sidewalls at the top surface is greater than at the bottom surface. A gate dielectric layer is formed on the top surface of the semiconductor body and on the sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric layer on the top surface and sidewalls of the semiconductor body. A pair of source/drain regions are formed in the semiconductor body on opposite sides of the gate electrode.
Public/Granted literature
- US20130264642A1 NONPLANAR DEVICE WITH THINNED LOWER BODY PORTION AND METHOD OF FABRICATION Public/Granted day:2013-10-10
Information query
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