Invention Grant
- Patent Title: Module and method of manufacturing a module
- Patent Title (中): 模块和模块的制造方法
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Application No.: US13116285Application Date: 2011-05-26
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Publication No.: US08749056B2Publication Date: 2014-06-10
- Inventor: Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
- Applicant: Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.
Public/Granted literature
- US20120299170A1 Module and Method of Manufacturing a Module Public/Granted day:2012-11-29
Information query
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