Invention Grant
- Patent Title: Mounting method and mounting device
- Patent Title (中): 安装方法和安装装置
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Application No.: US13519243Application Date: 2010-12-24
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Publication No.: US08749068B2Publication Date: 2014-06-10
- Inventor: Michikazu Nakamura , Masahiko Sugiyama , Dai Shinozaki , Naoki Akiyama
- Applicant: Michikazu Nakamura , Masahiko Sugiyama , Dai Shinozaki , Naoki Akiyama
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-297626 20091228
- International Application: PCT/JP2010/073351 WO 20101224
- International Announcement: WO2011/081093 WO 20110707
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
A mounting method of sequentially mounting elements on a substrate includes a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated. The method further includes a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region.
Public/Granted literature
- US20120292775A1 MOUNTING METHOD AND MOUNTING DEVICE Public/Granted day:2012-11-22
Information query
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