Invention Grant
- Patent Title: Integrated circuits and a method for manufacturing an integrated circuit
- Patent Title (中): 集成电路和集成电路的制造方法
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Application No.: US13602359Application Date: 2012-09-04
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Publication No.: US08749075B2Publication Date: 2014-06-10
- Inventor: Joachim Mahler , Lukas Ossowski , Khalil Hosseini , Ivan Nikitin
- Applicant: Joachim Mahler , Lukas Ossowski , Khalil Hosseini , Ivan Nikitin
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L23/29
Abstract:
An integrated circuit is provided. The integrated circuit includes: a chip and encapsulation material covering at least three sides of the chip, the encapsulation material being formed from adhesive material. The integrated circuit includes a carrier adhered to the chip by means of the encapsulation material.
Public/Granted literature
- US20140061878A1 INTEGRATED CIRCUITS AND A METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT Public/Granted day:2014-03-06
Information query
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