Invention Grant
- Patent Title: Fluorescent member and light emitting module
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Application No.: US13715385Application Date: 2012-12-14
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Publication No.: US08749128B2Publication Date: 2014-06-10
- Inventor: Yasuaki Tsutsumi , Masanobu Mizuno , Takashi Onishi
- Applicant: Koito Manufacturing Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Koito Manufacturing Co., Ltd.
- Current Assignee: Koito Manufacturing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2010-177144 20100806
- Main IPC: H05B33/00
- IPC: H05B33/00

Abstract:
In a plate-shaped fluorescent member configured to convert the wavelength of the light emitted by a semiconductor light emitting element, the fluorescent member is formed of an inorganic material having a refractive index of 1.5 or more and a light transmittance at the emission peak wavelength of the semiconductor light emitting element of less than 20%. A concave portion is formed, of the surfaces of the fluorescent member, on the surface on the side where the light in the semiconductor light emitting element is mainly emitted. In the fluorescent member, the light transmittance of the light having a wavelength of 380 nm to 500 nm may be less than 20%. The concave portion may be a groove. The concave portion may be a plurality of holes that are scattered.
Public/Granted literature
- US08786172B2 Fluorescent member and light emitting module Public/Granted day:2014-07-22
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