Invention Grant
- Patent Title: Coil-type electronic component and process for producing same
- Patent Title (中): 线圈型电子部件及其制造方法
-
Application No.: US13642467Application Date: 2011-04-26
-
Publication No.: US08749339B2Publication Date: 2014-06-10
- Inventor: Hideki Ogawa , Atsushi Tanada , Hitoshi Matsuura , Kiyoshi Tanaka , Hiroshi Kishi , Kenji Kawano
- Applicant: Hideki Ogawa , Atsushi Tanada , Hitoshi Matsuura , Kiyoshi Tanaka , Hiroshi Kishi , Kenji Kawano
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: JP2010-105552 20100430; JP2011-091879 20110418
- International Application: PCT/JP2011/060106 WO 20110426
- International Announcement: WO2011/136198 WO 20111103
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/02 ; B05D5/12

Abstract:
A coil-type electronic component has a coil inside or on the surface of its base material wherein the base material in the coil-type electronic component is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on its surface as a result of oxidization of the grain; this oxide layer contains the other element that oxidizes more easily than iron by a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via this oxide layer. The coil-type electronic component can be produced at low cost and combines high magnetic permeability with high saturation magnetic flux density.
Public/Granted literature
- US20130200970A1 COIL-TYPE ELECTRONIC COMPONENT AND PROCESS FOR PRODUCING SAME Public/Granted day:2013-08-08
Information query