Invention Grant
- Patent Title: Mobile wireless device
- Patent Title (中): 移动无线设备
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Application No.: US13070199Application Date: 2011-03-23
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Publication No.: US08749436B2Publication Date: 2014-06-10
- Inventor: Shintaro Yabe
- Applicant: Shintaro Yabe
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Priority: JP2010-071350 20100326
- Main IPC: H01Q1/24
- IPC: H01Q1/24

Abstract:
A mobile wireless device and method are disclosed. A circuit board is located in a housing, and antenna element means is adhered to an internal surface of the housing by an electrically conductive rubber member comprising adhesive agent means. A power input terminal is located on the circuit board and electrically coupled to an end of the electrically conductive rubber member.
Public/Granted literature
- US20110234459A1 MOBILE WIRELESS DEVICE Public/Granted day:2011-09-29
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