Invention Grant
- Patent Title: Haptic device for carving and molding objects
- Patent Title (中): 用于雕刻和成型物体的触觉装置
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Application No.: US13112909Application Date: 2011-05-20
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Publication No.: US08749533B2Publication Date: 2014-06-10
- Inventor: Suranjit Adhikari
- Applicant: Suranjit Adhikari
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery LLP
- Main IPC: G06F3/033
- IPC: G06F3/033

Abstract:
A system, method, and computer program product for automatically providing a haptic stylus based interface for enhanced user interaction with touch screen devices are disclosed. The stylus communicates with the touch screen device to report stylus operating information from onboard sensors, and to receive application program instructions defining feedback and friction forces to be applied by onboard actuators. The applied feedback and friction forces may be independently controlled. Friction forces are provided via a rolling contact ball gripping mechanism that mimics varying physical engagement between the contact ball and a touch screen display surface by controlling the relative rotational freedom of the contact ball. Embodiments of the invention enable a haptic stylus to mimic three-dimensional interactions for gaming, object manipulation and sculpting, and non-contact proximity-based stylus operation scenarios.
Public/Granted literature
- US20120293415A1 HAPTIC DEVICE FOR CARVING AND MOLDING OBJECTS Public/Granted day:2012-11-22
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