Invention Grant
US08749923B2 Suspension substrate, suspension, suspension with head and hard disk drive
有权
悬挂基板，悬架，悬挂带头和硬盘驱动器
- Patent Title: Suspension substrate, suspension, suspension with head and hard disk drive
- Patent Title (中): 悬挂基板，悬架，悬挂带头和硬盘驱动器
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Application No.: US12641656Application Date: 2009-12-18
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Publication No.: US08749923B2Publication Date: 2014-06-10
- Inventor: Kenro Hirata
- Applicant: Kenro Hirata
- Applicant Address: JP Tokyo-to
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo-to
- Agency: Ladas & Parry LLP
- Priority: JP2008-325298 20081222; JP2009-205858 20090907
- Main IPC: G11B5/48
- IPC: G11B5/48
Abstract:
A main object of the present invention is to provide a suspension substrate which can decrease the whole thickness thereof and limit the generation of warpage. To attain the object, the present invention provides a suspension substrate comprising: an insulation layer, a pair of wirings consisting of an upper wiring formed on one surface of the insulation layer and a lower wiring formed on the other surface of the insulation layer, and a metal substrate formed on the surface of the insulation layer on the lower wiring side.
Public/Granted literature
- US20100157482A1 SUSPENSION SUBSTRATE, SUSPENSION, SUSPENSION WITH HEAD AND HARD DISK DRIVE Public/Granted day:2010-06-24
Information query
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