Invention Grant
- Patent Title: Integrated optical interconnect
- Patent Title (中): 集成光互连
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Application No.: US13369324Application Date: 2012-02-09
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Publication No.: US08750660B2Publication Date: 2014-06-10
- Inventor: Shmuel Levy , Shai Cohen , Shai Rephaeli , Eyal Babish , Ronnen Lovinger
- Applicant: Shmuel Levy , Shai Cohen , Shai Rephaeli , Eyal Babish , Ronnen Lovinger
- Applicant Address: IL Yokneam
- Assignee: Mellanox Technologies Ltd.
- Current Assignee: Mellanox Technologies Ltd.
- Current Assignee Address: IL Yokneam
- Agency: D. Kligler I.P. Services Ltd.
- Main IPC: G02B6/30
- IPC: G02B6/30
Abstract:
A method for fabricating an integrated optical interconnect includes disposing a layer over a substrate on which at least one optoelectronic transducer has been formed. A groove is formed in the layer in alignment with the optoelectronic transducer. A slanted mirror is formed in the layer at an end of the groove adjacent to the optoelectronic transducer to direct light between the optoelectronic transducer and an optical fiber placed in the groove.
Public/Granted literature
- US20130209025A1 INTEGRATED OPTICAL INTERCONNECT Public/Granted day:2013-08-15
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