Invention Grant
US08750745B2 Image forming apparatus with high-voltage board 有权
高压板成像设备

  • Patent Title: Image forming apparatus with high-voltage board
  • Patent Title (中): 高压板成像设备
  • Application No.: US13153767
    Application Date: 2011-06-06
  • Publication No.: US08750745B2
    Publication Date: 2014-06-10
  • Inventor: Daisuke Fujiwara
  • Applicant: Daisuke Fujiwara
  • Applicant Address: JP
  • Assignee: Kyocera Mita Corporation
  • Current Assignee: Kyocera Mita Corporation
  • Current Assignee Address: JP
  • Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
  • Priority: JP2010-129914 20100607
  • Main IPC: G03G15/00
  • IPC: G03G15/00
Image forming apparatus with high-voltage board
Abstract:
An image forming apparatus has a first unit for performing an image forming process on a sheet, a frame having a first surface facing the first unit and a second surface opposite the first surface. A second unit is mounted on the second surface of the frame and a high-voltage board is mounted on the second surface of the frame with the second unit located therebetween. A connecting mechanism electrically connects the first unit and the high-voltage board to supply high voltage to the first unit. The connecting mechanism includes a unit-side wire extending at a side of the first surface and a board-side wire connectable to the unit-side wire and extending at a side of the second surface. The unit-side wire and the board-side wire are connected with contacts thereof pressed into contact with each other.
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