Invention Grant
- Patent Title: Image forming apparatus with high-voltage board
- Patent Title (中): 高压板成像设备
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Application No.: US13153767Application Date: 2011-06-06
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Publication No.: US08750745B2Publication Date: 2014-06-10
- Inventor: Daisuke Fujiwara
- Applicant: Daisuke Fujiwara
- Applicant Address: JP
- Assignee: Kyocera Mita Corporation
- Current Assignee: Kyocera Mita Corporation
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2010-129914 20100607
- Main IPC: G03G15/00
- IPC: G03G15/00

Abstract:
An image forming apparatus has a first unit for performing an image forming process on a sheet, a frame having a first surface facing the first unit and a second surface opposite the first surface. A second unit is mounted on the second surface of the frame and a high-voltage board is mounted on the second surface of the frame with the second unit located therebetween. A connecting mechanism electrically connects the first unit and the high-voltage board to supply high voltage to the first unit. The connecting mechanism includes a unit-side wire extending at a side of the first surface and a board-side wire connectable to the unit-side wire and extending at a side of the second surface. The unit-side wire and the board-side wire are connected with contacts thereof pressed into contact with each other.
Public/Granted literature
- US20110299874A1 IMAGE FORMING APPARATUS WITH HIGH-VOLTAGE BOARD Public/Granted day:2011-12-08
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