Techniques are described for detecting lead-related conditions for implantable electrical leads. In some of the described embodiments, an implantable electrical lead assembly is provided with a coupling member for connecting a conductor and associated insulator(s) to an electrode/sensing element. The implantable medical device controls and performs a measurement of an electrical property of the electrical lead during periods when the conductor is decoupled from the electrode/sensing element. An indication of a lead-related condition is derived based on the measured electrical property. The lead-related condition may be associated with an insulator of a lead body of the electrical lead.