Invention Grant
US08751714B2 Implementing quickpath interconnect protocol over a PCIe interface
有权
通过PCIe接口实现快速路径互连协议
- Patent Title: Implementing quickpath interconnect protocol over a PCIe interface
- Patent Title (中): 通过PCIe接口实现快速路径互连协议
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Application No.: US12889777Application Date: 2010-09-24
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Publication No.: US08751714B2Publication Date: 2014-06-10
- Inventor: Robert J. Safranek , Debendra Das Sharma , Ganapati N. Srinivasa
- Applicant: Robert J. Safranek , Debendra Das Sharma , Ganapati N. Srinivasa
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Law Office of R. Alan Burnett. P.S.
- Agent R. Alan Burnett
- Main IPC: G06F13/42
- IPC: G06F13/42

Abstract:
Methods and apparatus for implementing the Intel QuickPath Interconnect® (QPI) protocol over a PCIe interface. The upper layers of the QPI protocol are implemented over a physical layer of the PCIe interface via use of QPI data bit mappings onto corresponding PCIe x16, x8, and x4 lane configurations. A QPI link layer to PCIe physical layer interface is employed to abstract the QPI link, routing, and protocol layers from the underlying PCIe physical layer (and corresponding PCIe interface circuitry), enabling QPI protocol messages to be employed over PCIe hardware. Thus, QPI functionality, such as support for coherent memory transactions, may be implemented over PCIe interface circuitry.
Public/Granted literature
- US20120079156A1 IMPLEMENTING QUICKPATH INTERCONNECT PROTOCOL OVER A PCIe INTERFACE Public/Granted day:2012-03-29
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