Invention Grant
- Patent Title: Selecting an IC core tap linking module for scanning data
- Patent Title (中): 选择用于扫描数据的IC核心点击链接模块
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Application No.: US13941717Application Date: 2013-07-15
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Publication No.: US08751883B2Publication Date: 2014-06-10
- Inventor: Lee D. Whetsel
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Lawrence J. Bassuk; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
An integrated circuit can have plural core circuits, each having a test access port that is defined in IEEE standard 1149.1. Access to and control of these ports is though a test linking module. The test access ports on an integrated circuit can be arranged in a hierarchy with one test linking module controlling access to plural secondary test linking modules and test access ports. Each secondary test linking module in turn can also control access to tertiary test linking modules and test access ports. The test linking modules can also be used for emulation.
Public/Granted literature
- US20130305109A1 HIERARCHICAL ACCESS OF TEST ACCESS PORTS IN EMBEDDED CORE INTEGRATED CIRCUITS Public/Granted day:2013-11-14
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