Invention Grant
- Patent Title: Automatic wafer data sample planning and review
- Patent Title (中): 自动晶圆数据采样计划和审查
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Application No.: US13663816Application Date: 2012-10-30
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Publication No.: US08751980B2Publication Date: 2014-06-10
- Inventor: Nathalie Casati , David DeMaris , Maria Gabrani , Ronald P. Luijten
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Daniel Morris
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method of constructing a mask for use in semiconductor device manufacturing is disclosed. A first shape that is related to mask construction is selected from a set of shapes. A second shape related to the mask construction is selected from the set of shapes. The first shape and the second shape are represented using a first shape vector and a second shape vector, respectively. A cluster is formed that includes the first shape and the second shape when the first shape vector and the second shape vector are within a selected criterion.
Public/Granted literature
- US20140123083A1 AUTOMATIC WAFER DATA SAMPLE PLANNING AND REVIEW Public/Granted day:2014-05-01
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