Invention Grant
US08756802B2 Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
有权
用于半导体管芯和其他电子器件的碳纳米管接触结构
- Patent Title: Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
- Patent Title (中): 用于半导体管芯和其他电子器件的碳纳米管接触结构
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Application No.: US13731259Application Date: 2012-12-31
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Publication No.: US08756802B2Publication Date: 2014-06-24
- Inventor: John K. Gritters , Rodney I. Martens , Onnik Yaglioglu
- Applicant: FormFactor, Inc.
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agency: Kirton McConkie
- Main IPC: H01R9/00
- IPC: H01R9/00 ; H01K3/00
Abstract:
A method of making carbon nanotube contact structures on an electronic device includes growing a plurality of carbon nanotube columns on a mandrel. Electrically-conductive adhesive is applied to ends of the columns distal from the mandrel, and the columns are transferred to the electronic device. An electrically-conductive material is deposited onto some or all of the columns. The mandrel can be reused to grow a second plurality of carbon nanotube columns.
Public/Granted literature
- US20130140057A1 Carbon Nanotube Contact Structures For Use With Semiconductor Dies And Other Electronic Devices Public/Granted day:2013-06-06
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