An electronic device enclosure includes a rear plate defining a through hole, a side plate having a hook, a clipping device, and a rotating device. The clipping device includes a clipping member and a first resilient member. The clipping member may slide relative to the rear plate between a lock position and an unlock position. When the clipping member is located in the clock position, the hook is engaged in the through hole. When the clipping member is located in the unlock position, the hook is disengaged from the through hole. The rotating device is rotatably coupled to the side plate and may drive the clipping member to slide from the lock position to the unlock position. The first resilient member may drive the clipping member to slide from the unlock position to the lock position.