A device housing, especially for accommodating an electronic unit or a mechatronic unit, has parts which are sealed against one another in assembled condition via an encircling, stationary seal. At least one pressure-relief device is integrated into the seal for admission of air into the housing. The seal is formed at least in part as a lip that opens under overpressure conditions inside the housing. To allow any water that has penetrated to flow away, the housing is mounted vertically, with the pressure-relief device disposed at the bottom.