Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
-
Application No.: US13671234Application Date: 2012-11-07
-
Publication No.: US08757782B2Publication Date: 2014-06-24
- Inventor: Shunsuke Watanabe , Yoshinao Miyata , Satoshi Oguchi , Hiroaki Okui
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2011-253644 20111121
- Main IPC: B41J2/17
- IPC: B41J2/17

Abstract:
Liquid ejecting head comprises a unit head bonded to a communication substrate. A plurality of liquid chamber forming portions are formed in the unit case, along a first direction at positions that are separated by a partition wall. A plurality of empty liquid chamber portions and supply-side communication paths are formed in the communication substrate. The supply-side communication paths include a common communication path formed in a opposite side with a thin thickness portion left in the surface side of the communication substrate, and individual communication paths. With a surface of the partition wall and a surface of the thin thickness portion bonded together, the empty liquid chamber forming portions and the empty liquid chamber portions communicate with each other so as to define a plurality of common liquid chambers.
Public/Granted literature
- US20130127956A1 Liquid Ejecting Head and Liquid Ejecting Apparatus Public/Granted day:2013-05-23
Information query
IPC分类: