Invention Grant
- Patent Title: Fluid ejection assembly with circulation pump
- Patent Title (中): 带循环泵的流体喷射组件
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Application No.: US13703371Application Date: 2010-07-28
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Publication No.: US08757783B2Publication Date: 2014-06-24
- Inventor: Alexander Govyadinov , Erik D. Torniainen , Robert Messenger
- Applicant: Alexander Govyadinov , Erik D. Torniainen , Robert Messenger
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agent Nathan R. Rieth
- International Application: PCT/US2010/043480 WO 20100728
- International Announcement: WO2012/015397 WO 20120202
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B41J2/14

Abstract:
A fluid ejection assembly includes a fluid slot formed in a first substrate and a channel formed in a chamber layer disposed on top of a second substrate. The bottom surface of the second substrate is adhered to the top surface of the first substrate and fluid feed holes are formed between the fluid slot and the channel. A fluid ejection element is at a first end of the channel and a pump element is at a second end of the channel to circulate fluid horizontally through the channel and vertically through the fluid feed holes.
Public/Granted literature
- US20130083136A1 FLUID EJECTION ASSEMBLY WITH CIRCULATION PUMP Public/Granted day:2013-04-04
Information query
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