Invention Grant
- Patent Title: System for connecting a first substrate to a second substrate
- Patent Title (中): 用于将第一基板连接到第二基板的系统
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Application No.: US13759722Application Date: 2013-02-05
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Publication No.: US08758026B2Publication Date: 2014-06-24
- Inventor: Donald C. Mueller , Mark R. Mathews
- Applicant: Touchsensor Technologies, LLC
- Applicant Address: US IL Wheaton
- Assignee: Touchsensor Technologies, LLC
- Current Assignee: Touchsensor Technologies, LLC
- Current Assignee Address: US IL Wheaton
- Agency: Barnes & Thornburg LLP
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/70 ; H01R12/73
Abstract:
An interconnect apparatus for interconnecting electrical components includes a body and a spring element retained by and extending from the body. The apparatus is configured so that a portion thereof may be captured between first and second substrates and to connect electrical circuits lying in different planes.
Public/Granted literature
- US20130203271A1 ELECTRICAL CIRCUIT INTERCONNECT APPARATUS AND SYSTEM Public/Granted day:2013-08-08
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