Invention Grant
- Patent Title: Patch cord assemblies, methods and systems
- Patent Title (中): 跳线组件，方法和系统
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Application No.: US13399371Application Date: 2012-02-17
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Publication No.: US08758046B2Publication Date: 2014-06-24
- Inventor: John B. Pezzetti , Robert Scott Shew , Chester H. Rynaski , Gregory Moore
- Applicant: John B. Pezzetti , Robert Scott Shew , Chester H. Rynaski , Gregory Moore
- Applicant Address: US CT New London
- Assignee: Ortronics, Inc.
- Current Assignee: Ortronics, Inc.
- Current Assignee Address: US CT New London
- Agency: McCarter & English, LLP
- Main IPC: H01R13/60
- IPC: H01R13/60
Abstract:
A patch cord assembly is provided for detachably securing a first patch cord relative to a second patch cord, defined by a first patch cord that includes a first elongated cord and a first plug mounted with respect to one end of said first elongated cord, and a second patch cord that includes a second elongated cord and a second plug mounted with respect to one end of said second elongated cord. A method of patch cord assembly is provided for detachably securing a first patch cord relative to a second patch cord. A system of patch cord assembly packaging and payout is provided including a housing for packaging a patch cord assembly and at least one housing opening for paying out the at least first patch cord.
Public/Granted literature
- US20130115808A1 Patch Cord Assemblies, Methods and Systems Public/Granted day:2013-05-09
Information query
