Invention Grant
- Patent Title: Support structure for telecommunication jacks
- Patent Title (中): 电信插座的支撑结构
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Application No.: US13704352Application Date: 2011-05-25
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Publication No.: US08758048B2Publication Date: 2014-06-24
- Inventor: Mathieu Nesme , Guy Metral
- Applicant: Mathieu Nesme , Guy Metral
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Kristofor L. Storvick
- Priority: EP10166785 20100622
- International Application: PCT/US2011/037893 WO 20110525
- International Announcement: WO2011/162905 WO 20111229
- Main IPC: H01R13/60
- IPC: H01R13/60
Abstract:
In the field of telecommunication and data transmission, a jack support structure for fixing a plurality of modular telecommunications jacks on a patch panel. The jack support structure has at least two parallel rows of jack cavities, and fixing means for fixing the jack support structure on a patch panel, characterized by the fixing means being positioned only between two adjacent rows.
Public/Granted literature
- US20130090005A1 SUPPORT STRUCTURE FOR TELECOMMUNICATION JACKS Public/Granted day:2013-04-11
Information query
