Invention Grant
US08758087B2 Wafer processing method, wafer polishing apparatus, and ingot slicing apparatus
失效
晶片加工方法，晶片抛光装置和锭切片装置
- Patent Title: Wafer processing method, wafer polishing apparatus, and ingot slicing apparatus
- Patent Title (中): 晶片加工方法，晶片抛光装置和锭切片装置
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Application No.: US13114141Application Date: 2011-05-24
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Publication No.: US08758087B2Publication Date: 2014-06-24
- Inventor: Kyohei Koutake , Hiromichi Morita , Fumiyoshi Kano , Tetsuji Yamaguchi , Sumitomo Inomata , Masatake Nagaya
- Applicant: Kyohei Koutake , Hiromichi Morita , Fumiyoshi Kano , Tetsuji Yamaguchi , Sumitomo Inomata , Masatake Nagaya
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2010-119204 20100525
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B24B49/16
Abstract:
In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer.
Public/Granted literature
- US20110294403A1 WAFER PROCESSING METHOD, WAFER POLISHING APPARATUS, AND INGOT SLICING APPARATUS Public/Granted day:2011-12-01
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