Invention Grant
- Patent Title: Method and apparatus for protecting modular implant connection
- Patent Title (中): 用于保护模块化植入物连接的方法和装置
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Application No.: US12409015Application Date: 2009-03-23
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Publication No.: US08758446B2Publication Date: 2014-06-24
- Inventor: Aaron P. Smith
- Applicant: Aaron P. Smith
- Applicant Address: US IN Warsaw
- Assignee: Biomet Manufacturing, LLC
- Current Assignee: Biomet Manufacturing, LLC
- Current Assignee Address: US IN Warsaw
- Agency: Harness, Dickey
- Main IPC: A61F2/32
- IPC: A61F2/32
Abstract:
Apparatus and methods of protecting modular implant connection portions are provided. A guard includes an outer sidewall and an inner sidewall defining a cavity that covers a modular implant connection portion. The modular implant connection covered with the guard can facilitate test-fitting of other modular implant components and allows reaming of the tissue around the guard.
Public/Granted literature
- US20100241239A1 Method And Apparatus For Protecting Modular Implant Connection Public/Granted day:2010-09-23
Information query
IPC分类:
