Invention Grant
- Patent Title: Method and apparatus for removing contaminants from substrate
- Patent Title (中): 从基材去除污染物的方法和设备
-
Application No.: US13115649Application Date: 2011-05-25
-
Publication No.: US08758522B2Publication Date: 2014-06-24
- Inventor: Ji Zhu , Arjun Mendiratta , David Mui
- Applicant: Ji Zhu , Arjun Mendiratta , David Mui
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla Group, LLP
- Main IPC: B08B3/02
- IPC: B08B3/02

Abstract:
A cleaning material is applied to a surface of a substrate. The cleaning material includes one or more polymeric materials for entrapping contaminants present on the surface of the substrate. A rinsing fluid is applied to the surface of the substrate at a controlled velocity to effect removal of the cleaning material and contaminants entrapped within the cleaning material from the surface of the substrate. The controlled velocity of the rinsing fluid is set to cause the cleaning material to behave in an elastic manner when impacted by the rinsing fluid, thereby improving contaminant removal from the surface of the substrate.
Public/Granted literature
- US20120125375A1 Method and Apparatus for Removing Contaminants from Substrate Public/Granted day:2012-05-24
Information query
IPC分类: