Invention Grant
- Patent Title: Method of attaching elements by bonding
- Patent Title (中): 通过粘接附着元件的方法
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Application No.: US13141030Application Date: 2008-12-19
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Publication No.: US08758534B2Publication Date: 2014-06-24
- Inventor: Björn Weidmann , Anders Westerdahl
- Applicant: Björn Weidmann , Anders Westerdahl
- Applicant Address: SE Linköping
- Assignee: Saab AB
- Current Assignee: Saab AB
- Current Assignee Address: SE Linköping
- Agency: Venable LLP
- Agent Eric J. Franklin
- International Application: PCT/SE2008/051528 WO 20081219
- International Announcement: WO2010/071525 WO 20100624
- Main IPC: B29C65/52
- IPC: B29C65/52
Abstract:
A method of attaching a first portion and a second portion to each other. An adhesive is exposed to a low temperature in order to obtain a non-tacky adhesive. The non-tacky adhesive is arranged between the two portions. The adhesive is cured. Use of adhesive according to the method.
Public/Granted literature
- US20110315300A1 METHOD OF ATTACHING ELEMENTS BY BONDING Public/Granted day:2011-12-29
Information query
