Invention Grant
- Patent Title: Paper substrates containing high surface sizing and low internal sizing and having high dimensional stability
- Patent Title (中): 具有高表面施胶和低内部尺寸并具有高尺寸稳定性的纸基材
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Application No.: US13756901Application Date: 2013-02-01
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Publication No.: US08758565B2Publication Date: 2014-06-24
- Inventor: Kapil M. Singh , Dennis W. Anderson , Peter M. Froass , Yaoliang Hong , Kosaraju K. Mohan , Thomas R. Arnson , Yan C. Huang
- Applicant: International Paper Company
- Applicant Address: US TN Memphis
- Assignee: International Paper Company
- Current Assignee: International Paper Company
- Current Assignee Address: US TN Memphis
- Agent Thomas W. Barnes, III
- Main IPC: D21H11/00
- IPC: D21H11/00
Abstract:
This invention relates to a paper substrate containing high surface sizing and low internal sizing and having high dimensional stability, as well as methods of making and using the composition.
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