A system for electroplating a rotogravure cylinder out of a plating solution having a concentration of copper ions wherein the cylinder is connectable to a current source is provided. The system includes a plating apparatus configured to copper plate the cylinder comprising a non-dissolvable anode, a plating tank configured to receive the cylinder, a controller configured to control operation of the apparatus, and a tube for delivering a mixture of a hardener and the plating solution to the plating tank.