An apparatus for receiving a plurality of mold assemblies having a first mold portion and a second mold portion operably connected together for forming parts. The apparatus includes a mold holding member and a pair of spaced apart support members extending from the mold holding member to a manufacturing floor. A carriage device is cooperable with the mold holding member for engaging and moving the mold assembly. A lifting mechanism is used for moving the carriage device relative the mold holding member to move the mold assembly to be engaged with mold holding member. A turn table adjacent to the mold holding member holds the mold assemblies and is movable relative the mold holding member thereby replacing the mold assemblies. A controller is operably connected to the mold holding member and the turn table thereby moving the turn table relative the mold holding member to interchange the mold assemblies.