Invention Grant
- Patent Title: Method of depositing electrically conductive material onto a substrate
- Patent Title (中): 将导电材料沉积到基底上的方法
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Application No.: US12671751Application Date: 2008-07-30
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Publication No.: US08758849B2Publication Date: 2014-06-24
- Inventor: James M. Olzak
- Applicant: James M. Olzak
- Applicant Address: US PA Kittanning
- Assignee: Francis C. Dlubak
- Current Assignee: Francis C. Dlubak
- Current Assignee Address: US PA Kittanning
- Agency: Pietragallo Gordon Alfano Bosick & Raspanti, LLP
- Agent Alan G. Towner, Esq.
- International Application: PCT/US2008/701516 WO 20080730
- International Announcement: WO2009/020804 WO 20090212
- Main IPC: B05D1/12
- IPC: B05D1/12 ; B05D5/12 ; B05D1/38 ; H05K3/14 ; C23C24/04
Abstract:
A method of depositing electrically conductive material onto a dielectric substrate is provided. The method includes the steps of providing a dielectric substrate and depositing electrically conductive material onto the dielectric substrate using a cold spray gas dynamic process, wherein the cold spray gas dynamic process accelerates the electrically conductive material to a supersonic velocity.
Public/Granted literature
- US20110236566A1 Method of Depositing Electrically Conductive Material onto a Substrate Public/Granted day:2011-09-29
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