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US08758867B2 Neutral ligand containing precursors and methods for deposition of a metal containing film 有权
含中性配体的前体和沉积含金属膜的方法

Neutral ligand containing precursors and methods for deposition of a metal containing film
Abstract:
Methods and compositions for depositing metal films are described herein. In general, the disclosed methods utilize precursor compounds comprising gold, silver or copper. More specifically, the disclosed precursor compounds utilize neutral ligands derived from ethylene or acetylene.
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