Invention Grant
- Patent Title: Positive photosensitive polyimide composition
- Patent Title (中): 正光敏聚酰亚胺组合物
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Application No.: US12921281Application Date: 2009-03-06
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Publication No.: US08758976B2Publication Date: 2014-06-24
- Inventor: Hye-Ran Seong , Chan-Hyo Park , Dong-Hyun Oh , Hye-In Shin , Kyung-Jun Kim , Se-Jin Shin
- Applicant: Hye-Ran Seong , Chan-Hyo Park , Dong-Hyun Oh , Hye-In Shin , Kyung-Jun Kim , Se-Jin Shin
- Applicant Address: KR Seoul
- Assignee: LG Chem Ltd.
- Current Assignee: LG Chem Ltd.
- Current Assignee Address: KR Seoul
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: KR10-2008-0021535 20080307
- International Application: PCT/KR2009/001121 WO 20090306
- International Announcement: WO2009/110764 WO 20090911
- Main IPC: C08L79/08
- IPC: C08L79/08 ; C08L77/04 ; G03F7/039 ; G03F7/075 ; H01L51/52 ; G03F7/023
Abstract:
The present invention relates to a positive photosensitive polyimide composition that includes polyimide, a polyamic acid, and a photoactive compound. An organic insulating layer for organic light-emitting devices (OLED), which includes the positive photosensitive polyimide composition, may control a taper angle and outgassing, and has excellent adhesion in respects to a substrate, water repellent control ability, and storage stability and the like.
Public/Granted literature
- US20110059397A1 POSITIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION Public/Granted day:2011-03-10
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