Invention Grant
US08758978B2 Radiation-sensitive resin composition, resist pattern formation method, and polymer
有权
辐射敏感性树脂组合物，抗蚀剂图案形成方法和聚合物
- Patent Title: Radiation-sensitive resin composition, resist pattern formation method, and polymer
- Patent Title (中): 辐射敏感性树脂组合物，抗蚀剂图案形成方法和聚合物
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Application No.: US13417335Application Date: 2012-03-12
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Publication No.: US08758978B2Publication Date: 2014-06-24
- Inventor: Mitsuo Satou , Tomohiro Kakizawa
- Applicant: Mitsuo Satou , Tomohiro Kakizawa
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2009-222622 20090928
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/40 ; C08F18/20 ; C08F26/00
Abstract:
A radiation-sensitive resin composition includes a first polymer, a second polymer and a radiation-sensitive acid generator. The first polymer includes a repeating unit (I) shown by the following general formula (1), a fluorine atom in a molecule of the first polymer. The second a polymer includes an acid-labile group, and is insoluble or scarcely soluble in an alkali. R1 represents a hydrogen atom or the like, each of X1 and R2 represents a single bond or the like, R3 represents a hydrogen atom or the like, and R4 represents an acid-labile group.
Public/Granted literature
- US20120171612A1 RADIATION-SENSITIVE RESIN COMPOSITION, RESIST PATTERN FORMATION METHOD, AND POLYMER Public/Granted day:2012-07-05
Information query
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