A method for making a light emitting chip package, comprises: providing a substrate; forming a plurality of recesses on the bottom surface of the substrate; forming an etch stop layer on the bottom surface; forming a step hole on the top surface; forming an insulation layer on the top surface; defining a plurality of first through holes in the insulation layer and a plurality of second through holes in the etch stop layer, the number of the first through holes being different from the number of the second through holes; filling the first through holes and the second through holes with metal to respectively form first electrical conductor portions and second electrical conductor portions; forming a patterned electric conductive layer on the insulation layer; arranging a light emitting chip on the electric conductive layer; and encapsulating the light emitting chip with an encapsulation.