Invention Grant
- Patent Title: Method for manufacturing integral imaging device
- Patent Title (中): 集成成像装置的制造方法
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Application No.: US13527910Application Date: 2012-06-20
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Publication No.: US08759164B2Publication Date: 2014-06-24
- Inventor: Chia-Ling Hsu
- Applicant: Chia-Ling Hsu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW101105708A 20120221
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
In a method for manufacturing an integral imaging device, a layer of curable adhesive is first applied on a flexible substrate and half cured such that the curable adhesive is solidified but is capable of deforming under external forces. Then the curable adhesive is printed into a lenticular lens having a predetermined shape and size using a roll-to-roll processing device and fully cured such that the curable adhesive is capable of withstanding external forces to hold the predetermined shape and size. Last, a light emitting diode display is applied on the flexible substrate opposite to the lenticular lens such that an image plane of the light emitting diode display coincides with a focal plane of the lenticular lens.
Public/Granted literature
- US20130217161A1 METHOD FOR MANUFACTURING INTEGRAL IMAGING DEVICE Public/Granted day:2013-08-22
Information query
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