Tunable semiconductor component provided with a current barrier

Invention Grant

US08759191B2 Tunable semiconductor component provided with a current barrier 失效

Title translation: 具有电流屏障的可调谐半导体元件

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Patent Title: Tunable semiconductor component provided with a current barrier
Patent Title (中): 具有电流屏障的可调谐半导体元件
Application No.: US13705114

Application Date: 2012-12-04
Publication No.: US08759191B2

Publication Date: 2014-06-24
Inventor: Alain Lacourse , Mathieu Ducharme , Hugo St-Jean , Yves Gagnon , Yvon Savaria , Michel Meunier
Applicant: Cadeka Microcircuits, LLC
Applicant Address: US CO Loveland
Assignee: Cadeka Microcircuits, LLC
Current Assignee: Cadeka Microcircuits, LLC
Current Assignee Address: US CO Loveland
Agency: CR Miles P.C.
Agent Craig R. Miles
Main IPC: H01L21/4757
IPC: H01L21/4757

Tunable semiconductor component provided with a current barrier

Abstract:

Semiconductor component or device is provided which includes a current barrier element and for which the impedance may be tuned (i.e. modified, changed, etc.) using a focused heating source.

Abstract(Chinese):

提供了包括电流屏障元件的半导体元件或器件，并且可以使用聚焦加热源对阻抗进行调谐（即修改，改变等）。

Public/Granted literature

US20130095651A1 Tunable Semiconductor Component Provided with a Current Barrier Public/Granted day:2013-04-18

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34	...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/46	....用H01L21/36至H01L21/428各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/44）
H01L21/461	.....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割
H01L21/469	......在半导体材料上形成绝缘层的，例如，用于掩膜的或应用光刻技术的（密封层入H01L21/56）以及这些层的后处理
H01L21/4757	.......后处理