Invention Grant
- Patent Title: Heat-resistant resin paste
- Patent Title (中): 耐热树脂膏
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Application No.: US12375719Application Date: 2007-06-01
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Publication No.: US08759440B2Publication Date: 2014-06-24
- Inventor: Hiroyuki Kawakami , Kouji Yamazaki , Takuya Imai , Youji Katayama
- Applicant: Hiroyuki Kawakami , Kouji Yamazaki , Takuya Imai , Youji Katayama
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2006-207931 20060731
- International Application: PCT/JP2007/061192 WO 20070601
- International Announcement: WO2008/015839 WO 20080207
- Main IPC: C08G69/26
- IPC: C08G69/26 ; C08K5/00 ; C08L77/00
Abstract:
Provided is a heat-resistant resin paste excellent in heat resistance, flexibility, printability and viewability. A heat-resistant resin paste containing a first organic solvent (A1), a second organic solvent (A2) containing a lactone, a heat-resistant resin (B) soluble in a mixed solvent of the solvents (A1) and (A2), a heat-resistant resin filler (C) insoluble in the mixed organic solvent of the solvents (A1) and (A2), and a pigment (D), wherein the components (C) and (D) are dispersed in a solution containing the solvents (A1) and (A2) and the component (B).
Public/Granted literature
- US20090264582A1 HEAT-RESISTANT RESIN PASTE Public/Granted day:2009-10-22
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