Invention Grant
- Patent Title: Hermetically sealed housing for electronic components and manufacturing method
- Patent Title (中): 电子元器件密封外壳及制造方法
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Application No.: US12993299Application Date: 2009-05-26
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Publication No.: US08759677B2Publication Date: 2014-06-24
- Inventor: Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
- Applicant: Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
- Applicant Address: DE Munich
- Assignee: Epcos AG
- Current Assignee: Epcos AG
- Current Assignee Address: DE Munich
- Agency: Nixon Peabody LLP
- Priority: DE102008025202 20080527
- International Application: PCT/EP2009/056377 WO 20090526
- International Announcement: WO2009/144224 WO 20091203
- Main IPC: H01J5/00
- IPC: H01J5/00 ; H01J15/00 ; H05K5/06 ; H05H1/00 ; H05K7/00 ; H05K7/10 ; H05K7/12
Abstract:
Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).
Public/Granted literature
- US20110114355A1 HERMETICALLY SEALED HOUSING FOR ELECTRONIC COMPONENTS AND MANUFACTURING METHOD Public/Granted day:2011-05-19
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