Invention Grant
- Patent Title: Wire to conductive metal plate laser welding structure
- Patent Title (中): 导线金属板激光焊接结构
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Application No.: US13238634Application Date: 2011-09-21
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Publication No.: US08759679B2Publication Date: 2014-06-24
- Inventor: Takushi Yoshida , Tomoki Inudo , Hiroshi Akimoto
- Applicant: Takushi Yoshida , Tomoki Inudo , Hiroshi Akimoto
- Applicant Address: JP Tokyo
- Assignee: Japan Aviation Electronics Industry, Ltd.
- Current Assignee: Japan Aviation Electronics Industry, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Maier & Maier, PLLC
- Priority: JP2011-056454 20110315
- Main IPC: B23K11/00
- IPC: B23K11/00 ; B23K26/00
Abstract:
A laser welding structure that is formed by joining a stranded wire (wire) of a signal line and a welding portion (conductive metal plate) by locally applying a laser beam and thereby melting and solidifying the stranded wire of the signal line and the welding portion has the following features. That is, the melting point of the stranded wire of the signal line and the melting point of the welding portion are different. The laser welding structure is obtained by applying a laser beam to one of the stranded wire of the signal line and the welding portion that has a higher melting point, i.e., to the welding portion having a higher melting point.
Public/Granted literature
- US20120237787A1 WIRE TO CONDUCTIVE METAL PLATE LASER WELDING STRUCTURE Public/Granted day:2012-09-20
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