Invention Grant
- Patent Title: Wire protective member
- Patent Title (中): 电线保护构件
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Application No.: US12616961Application Date: 2009-11-12
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Publication No.: US08759681B2Publication Date: 2014-06-24
- Inventor: Masayuki Doi , Toshitsugu Morii , Arisa Imatoku
- Applicant: Masayuki Doi , Toshitsugu Morii , Arisa Imatoku
- Applicant Address: JP
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2008-295538 20081119; JP2009-068783 20090319
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H01B7/08

Abstract:
A wire protective member (10) is provided for covering a wire (11) from an outer side. The wire protective member (10) has a first base (13) includes a first adhesive layer (12) to be bonded to the wire (11) on one surface thereof, a second base (16) to be placed on a surface of the first base (13) opposite to the one including the first adhesive layer (12), and spacers (14) formed between the first and second bases (13, 16). No clearance is formed between the wire (11) and the protective member (10) to achieve a space saving. Further, since it is sufficient to wrap the wire (11) with one member composed of the first adhesive layer (12), the first base (13), the layer partly formed with the spacers (14) and the second base (16), time and effort for a mounting operation and the number of parts can be reduced.
Public/Granted literature
- US20100122835A1 WIRE PROTECTIVE MEMBER Public/Granted day:2010-05-20
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