Invention Grant
US08759707B2 Manufacturing and use of microperforated substrates 有权
微孔基材的制造和使用

  • Patent Title: Manufacturing and use of microperforated substrates
  • Patent Title (中): 微孔基材的制造和使用
  • Application No.: US10594991
    Application Date: 2005-03-30
  • Publication No.: US08759707B2
    Publication Date: 2014-06-24
  • Inventor: Christian Schmidt
  • Applicant: Christian Schmidt
  • Applicant Address: CH Lausanne
  • Assignee: Picodrill SA
  • Current Assignee: Picodrill SA
  • Current Assignee Address: CH Lausanne
  • Agency: Pearl Cohen Zedek Latzer Baratz LLP
  • Priority: CH2004/000206 20040401; CH2004/000279 20040507
  • International Application: PCT/EP2005/003319 WO 20050330
  • International Announcement: WO2005/097439 WO 20051020
  • Main IPC: B23H1/02
  • IPC: B23H1/02
Manufacturing and use of microperforated substrates
Abstract:
This invention relates to methods and devices for the production of micro-structured substrates and their application in natural sciences and technology, in particular in analysis and detection systems based on artificial and biological lipid membranes. The structure is preferably a hole or a cavity or channel and is obtained by spark perforation. Energy, preferably heat, is applied to the region to be structured so as to reduce the amplitude of voltage required and/or soften the material. The electrical parameters of the spark perforation are feedback-controlled.
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