Invention Grant
- Patent Title: Manufacturing and use of microperforated substrates
- Patent Title (中): 微孔基材的制造和使用
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Application No.: US10594991Application Date: 2005-03-30
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Publication No.: US08759707B2Publication Date: 2014-06-24
- Inventor: Christian Schmidt
- Applicant: Christian Schmidt
- Applicant Address: CH Lausanne
- Assignee: Picodrill SA
- Current Assignee: Picodrill SA
- Current Assignee Address: CH Lausanne
- Agency: Pearl Cohen Zedek Latzer Baratz LLP
- Priority: CH2004/000206 20040401; CH2004/000279 20040507
- International Application: PCT/EP2005/003319 WO 20050330
- International Announcement: WO2005/097439 WO 20051020
- Main IPC: B23H1/02
- IPC: B23H1/02

Abstract:
This invention relates to methods and devices for the production of micro-structured substrates and their application in natural sciences and technology, in particular in analysis and detection systems based on artificial and biological lipid membranes. The structure is preferably a hole or a cavity or channel and is obtained by spark perforation. Energy, preferably heat, is applied to the region to be structured so as to reduce the amplitude of voltage required and/or soften the material. The electrical parameters of the spark perforation are feedback-controlled.
Public/Granted literature
- US20080047935A1 Manufacturing and Use of Microperforated Substrates Public/Granted day:2008-02-28
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