Invention Grant
- Patent Title: Teramos-terahertz thermal sensor and focal plane array
- Patent Title (中): 太平洋太赫兹热传感器和焦平面阵列
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Application No.: US13141694Application Date: 2009-12-22
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Publication No.: US08759776B2Publication Date: 2014-06-24
- Inventor: Yael Nemirovsky
- Applicant: Yael Nemirovsky
- Applicant Address: IL Haifa
- Assignee: Technion Research and Development Foundation Ltd.
- Current Assignee: Technion Research and Development Foundation Ltd.
- Current Assignee Address: IL Haifa
- Agent Oren Reches
- International Application: PCT/IL2009/001205 WO 20091222
- International Announcement: WO2010/076783 WO 20100708
- Main IPC: G01J5/02
- IPC: G01J5/02 ; G01T1/24

Abstract:
A TeraMOS sensor based on a CMOS-SOI-MEMS transistor, thermally isolated by the MEMS post-processing, designed specifically for the detection of THz radiation which may be directly integrated with the CMOS-SOI readout circuitry, in order to achieve a breakthrough in performance and cost. The TeraMOS sensor provides a low-cost, high performance THz passive or active imaging system (roughly in the range of 0.5-1.5 THz) by combining several leading technologies: Complementary Metal Oxide Semiconductor (CMOS)-Silicon on Insulator (SOI), Micro Electro Mechanical Systems (MEMS) and photonics. An array of TeraMOS sensors, integrated with readout circuitry and driving and supporting circuitry provides a monolithic focal plane array or imager. This imager is designed in a commercial CMOS-SOI Fab and the MEMS micromachining is provided as post-processing step in order to reduce cost. Thus the CMOS transistors and technology provide the sensors as well as the signal processing and additional readout circuitry both in the pixels as well as around the sensor array.
Public/Granted literature
- US20110315880A1 TERAMOS-TERAHERTZ THERMAL SENSOR AND FOCAL PLANE ARRAY Public/Granted day:2011-12-29
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