Invention Grant
- Patent Title: Light emitting device package and lighting system
- Patent Title (中): 发光装置封装和照明系统
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Application No.: US13020157Application Date: 2011-02-03
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Publication No.: US08759841B2Publication Date: 2014-06-24
- Inventor: Sung Min Hwang , Hyun Don Song , Woon Kyung Choi
- Applicant: Sung Min Hwang , Hyun Don Song , Woon Kyung Choi
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2010-0014770 20100218
- Main IPC: H01L27/15
- IPC: H01L27/15

Abstract:
A light emitting device package includes a sub mount; a light emitting device on the sub mount, and configured to generate light of a first wavelength; a dielectric layer disposed on the sub mount; and a fluorescent layer on the dielectric layer, and configured to convert the light of the first wavelength into light of a second wavelength, wherein the dielectric layer includes a plurality of layers having at least two different refractive indices, that transmits the light of the first wavelength and reflects the light of the second wavelength.
Public/Granted literature
- US20110198644A1 LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM Public/Granted day:2011-08-18
Information query
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