Invention Grant
- Patent Title: Semiconductor light emitting device utilising punch-through effects
- Patent Title (中): 半导体发光器件利用穿透效应
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Application No.: US12863743Application Date: 2009-01-21
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Publication No.: US08759845B2Publication Date: 2014-06-24
- Inventor: Lukas Willem Snyman , Monuko Du Plessis
- Applicant: Lukas Willem Snyman , Monuko Du Plessis
- Applicant Address: ZA Pretoria
- Assignee: Insiava (Pty) Limited
- Current Assignee: Insiava (Pty) Limited
- Current Assignee Address: ZA Pretoria
- Agency: Nixon & Vanderhye PC
- Priority: ZA2008/00593 20080121
- International Application: PCT/IB2009/050209 WO 20090121
- International Announcement: WO2009/093177 WO 20090730
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L29/167 ; H01L31/12 ; H01L33/00

Abstract:
A light emitting device (10) comprises a body (12) of a semiconductor material. A first junction region (14) is formed in the body between a first region (12.1) of the body of a first doping kind and a second region (12.2) of the body of a second doping kind. A second junction region (16) is formed in the body between the second region (12.2) of the body and a third region (12.3) of the body of the first doping kind. A terminal arrangement (18) is connected to the body for, in use, reverse biasing the first junction region (14) into a breakdown mode and for forward biasing at least part (16.1) of the second junction region (16), to inject carriers towards the first junction region (14). The device (10) is configured so that a first depletion region (20) associated with the reverse biased first junction region (14) punches through to a second depletion region associated with the forward biased second junction region (16).
Public/Granted literature
- US20110031893A1 SEMICONDUCTOR LIGHT EMITTING DEVICE UTILISING PUNCH-THROUGH EFFECTS Public/Granted day:2011-02-10
Information query
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