Invention Grant
- Patent Title: Light emitting device including support member and bonding member
- Patent Title (中): 发光装置,包括支撑构件和接合构件
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Application No.: US13229524Application Date: 2011-09-09
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Publication No.: US08759855B2Publication Date: 2014-06-24
- Inventor: Kazuhiro Kamada
- Applicant: Kazuhiro Kamada
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Foley & Lardner LLP
- Priority: JP2010-203303 20100910; JP2011-180079 20110822
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A light emitting device includes a support member having a mounting surface. The support member includes an insulating member having top surface and a plurality of side surfaces, a first metal pattern disposed on the top surface of the insulating member, and a second metal pattern disposed on the side surface of the insulating member such that a side surface of the second metal pattern is continuous with a top surface of the first metal pattern. The light emitting device further includes a light emitting element mounted on the mounting surface at a location of the first metal pattern, and a bonding member that bonds the light emitting element to the mounting surface. The bonding member covers at least a portion of the first metal pattern and at least a portion of the second metal pattern.
Public/Granted literature
- US20120061706A1 SUPPORTING MEMBER AND LIGHT EMITTING DEVICE USING THE SUPPORTING MEMBER Public/Granted day:2012-03-15
Information query
IPC分类: